In Level 1, 2 and 3 we teach you the:

 

• Concept and structure of GSM, CDMA, 3G, 4G networks and BGA Controller Chip

• Theory and concept of ESN, IMEI and SIM relationships

• Determination of physical and liquid damage detection on PCB Boards

• Use of Digital equipment to spot treat board level corrosions

• Proper use and knowledge of Stereo Microscope

• Ultrasonic Bath and its operating instructions

• Board cleaning agent and solutions to treat liquid damaged cell phones

• RF Shielding removal using a proper heating element

• Beginning soldering and de soldering techniques

• Use of proper tools and opening techniques to dismantle devices

• No network signal or unstable signal

 

We teach how to:

 

• Make a model of all cell phones

• Assemble and disassemble on straight, flip and sliding phones

• Change the keypad input membrane and key contact corrosion repair

• Data transfer and recovery techniques

• Cell Phone Unlocking - how to take carrier locks off GSM Phones

• Replacement techniques on all famous brand of mobile phone LCD repair, charging and touchpad replacement

• How to repair phone not powering on (no power), no network signal or unstable signal

• How to repair your Phone when it automatically shuts off (Power Cycling)

• How to replace the Sim Connector, Switch, Battery connector, SD memory connector, Vibrator, Flex Cable Switch, Multi pin Data Port, LCD plug-in connector, BGA IC,  and Charging Port 

• How to repair on-board components, circuit bridging and Jumper techniques

• How to identify, treat and repair Water Damaged Cell Phones

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We teach you Repair Techniques on:

 

• Troubleshooting on GSM and CDMA Phones

• Troubleshooting on GSM and CDMA Circuit Boards

• Water Damage

• Physical damage

• LCD’s, Ribbon flex cable, Camera and touch screen glass digitizer board plug-in connectors

• Components on circuit board block diagram and layout architecture

• Phone malfunction and liquid damage troubleshooting

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Level 3

Advanced Level III Course

• BGA Controller Chip Structure and Design

• Circuit board block diagram layout architecture - For Component Repairs

• Level III Water Damage Phone Troubleshooting and Repair

• Physical damage repair and troubleshooting techniques on GSM and CDMA Circuit Boards

• Repair for TechniquesOn Board Soldered Charging Port

• Repair for TechniquesOn Board Soldered Sim Card Connector

• Repair for TechniquesOn Board SD Memory Card connector

• Repair for TechniquesOn Board Multi Pin Data Port

• Repair for TechniquesOn Board Battery Connector

• Repair for TechniquesOn Board Multi Vibrator

• Repair LCD, Ribbon flex cable, Camera & touch screen glass digitizer board plug-in connectors

• RF Shielding removal using proper heating element

• No network signal or unstable signal

• Repair missing onboard components, circuit bridging & Jumpering techniques

• Identify, Treat and Repair Water Damaged Cell Phones

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• Phone automatically shuts off - Power Cycling Why?

• Use of Digital equipment to spot treat board level corrosion

• Knowledge of Stereo Microscope and its proper use

• Ultrasonic Bath and its operating instructions

• Board cleaning agent and solutions to treat liquid damaged cell phones. Phone automatically shuts off - Power Cycling

• Replace Connector, Switches, Battery connector, SD memory connector, Vibrator, Flex Cable Switch, Multi pin, Data Port, LCD plug-in connector and Charging Port Onboard Sim

• Repair missing onboard components, circuit bridging & Jumpering techniques

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