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  • Brand new

  • Size: approx. 90*38mm

  • Capacity: 30ml



  • 30ml BGA IC glue epoxy remover.

  • Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

  • Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

  • It won't do harm to your circuit board and components.

  • Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.

  • Convenient to use.


How to Use:

  • 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.

  • 2. Place a plastic bag or film on the top and cover the PCB board.

  • 3. Wait for about 20 minutes.

  • 4. Redo step 1 to step 3.

  • 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.

  • 6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.

  • 7. To remove the chip with a tweezers or cutter.


Package included:

  • 1 x BGA Glue

  • 1 x User Manual

1 Bottle BGA IC Adhesive Glue Epoxy Remover Removing Cell Phone CPU Chip Cleaner

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